Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices
AssigneeSumitomo Bakelite Co., Ltd.
InventorsMasakatu Maeda, Shinichi Iwasaki
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Abstract
An epoxy resin composition for sealing semiconductors which does not contain any halogen compounds or antimony compounds, has an excellent flame retarding property and shows excellent high temperatures storage life and reliability in a humid condition, and a semiconductor device are provided. The epoxy resin composition for sealing semiconductors comprises (A) an epoxy resin, (B) a phenol resin curing agents, (C) a curing accelerator, (D) an inorganic filler and (E) zinc molybdate as the essential components and the semiconductor device is sealed with this epoxy resin composition.
Claims24
An epoxy resin composition for sealing semiconductors which comprises (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) zinc molybdate as essential components.
An epoxy resin composition for sealing semiconductors according to claim, 3, wherein the epoxy resin is a crystalline epoxy resin represented by the following formula [1], [2] or [3]:
- wherein R represents hydrogen atom, a halogen atom or an alkyl group having 1 to 12 carbon atoms and the plurality of R may be the same with or different from each other.
Dependencies are inferred from the claim text.