Epoxy resin composition and resin-encapsulated semiconductor device

Abstract

Provided is an epoxy resin composition comprising: (A) an epoxy compound represented by the general formula (1): wherein, R1 to R9 represent each independently a hydrogen atom, an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom, (B) a polyfunctional epoxy compound having a functional group number of two or more, and (C) an epoxy curing agent containing a phenolic hydroxyl group, wherein the proportion of the epoxy compound (A) is from 1 to 99% by weight based on the total weight of the epoxy compounds (A) and (B). The epoxy resin composition has low moisture absorption and other properties well-balanced for use as a material for encapsulating electronic parts.

Dependencies are inferred from the claim text.