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AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYei-Shen Wu, Kun-Ching Chen, Su Tao
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A method for plating gold to a plurality of bond leads on a substrate is disclosed. The method first extends a plating line from a plating loop on the edge of the substrate to a bond area in the center portion of the substrate to electrically connect the plurality of bond leads in series. The plating line further extends to connect to the plating loop after connecting the plurality of bond leads together. Then, electricity is applied to the plurality of bond leads via the plating loop and the plating line thereby plates gold to the plurality of bond leads. Finally, a bonding tool is used to cut off and remove the plating line when the bonding tool is provided to bond the plurality of bond leads to a die that is attached to the substrate, whereby the residual plating line remaining on the substrate does not affect the performance of the semiconductor chip.
A method for plating gold to a plurality of bond leads on a substrate (10), said substrate (10) having a center portion defined therein a bond area (12) and an edge formed thereon a plating loop (14), each one of said plurality of bond leads having an end located in said bond area (12) and the other end connected with a ball land (13) formed on said substrate (10), a die (21) having a plurality of solder pads (211) being provided to electrically connect with said substrate (10) by bonding said plurality of bond leads to said plurality of solder pads (211), respectively, said method comprising the steps of:
Dependencies are inferred from the claim text.