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US 6,190,237 B1Granted
pH-buffered slurry and use thereof for polishing
AssigneeInternational Business Machines Corporation
InventorsCuc Kim Huynh, Mahadevaiyer Krishnan, Michael Joseph MacDonald, Mark Peter Murray
Life of this patent
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Abstract
A slurry containing abrasive particles and a pH buffering component comprising at least one acid or salt thereof and at least one base is especially useful for polishing surfaces, including those used in microelectronics.
Claims19
A multistep method for polishing a surface which comprises polishing said surface by first contacting it with a first slurry comprising abrasive particles and having a pH of about 1 to about 6 and contacting and polishing the surface having the slurry thereon with a polishing pad;
- followed by providing on said surface a second and different slurry comprising abrasive particles, a pH of about 3 to about 11 and a pH buffering component comprising at least one acid or salt thereof or mixture thereof in a concentration of about 10−5 M to about 102 M and at least one base or salt thereof or mixture thereof in a concentration of about 10−5 M to about 102 M and wherein the buffering component of the second slurry is free of metal cations, and polishing said surface having said second slurry thereon by contacting it with a polishing pad, wherein said acid and/or said base also acts as a complexing agent for metal cations.
Dependencies are inferred from the claim text.