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AssigneeInternational Business Machines Corporation
InventorsPanayotis Constantinou Andricacos, Cyril Cabral, Jr., Roy Carruthers, Alfred Grill, Katherine Lynn Saenger
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Multilayer metal materials are selected so that the materials will alloy or intermix under rapid thermal annealing conditions. The individual materials of the multilayers are preferably chosen such that at least one of the materials may be selectively etched with respect to the other material by wet chemical or electrochemical etching. For electroplating applications, the alloyed plating base material will assume some of the etch resistance of the original electrodeposit material such that a selective wet etch of the plating base can be performed without substantial undercutting. Furthermore, the graded composition alloy will exhibit other advantageous physical and chemical properties for electrode formation and use. The alloying or intermixing may be accomplished before or after patterning of the materials, for the instance wherein the materials deposited as blanket layers. Similarly, the alloying or intermixing may be accomplished before or after plating base removal for structures deposited by through-mask plating.
A patterned conductive structure formed on a substrate, said structure comprising:
A capacitor structure formed on a substrate having a conductive contact region, said capacitor structure comprising:
A capacitor structure formed on a substrate having a conductive contact region comprising:
A capacitor structure formed on a substrate having a conductive contact region comprising:
Dependencies are inferred from the claim text.