Method of fabrication of multiple-layer high density substrate
AssigneeFujitsu Limited
InventorsWilliam T. Chou, Solomon I. Beilin, Michael Guang-Tzong Lee, Michael G. Peters, Wen-Chou Vincent Wang
Life of this patent
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Abstract
A method of fabricating a multi-layer interconnected substrate structure. The inventive method includes forming a multi-layer structure from multiple, pre-fabricated power and/or signal substrates which are laminated together. A drill is then used to form a via through the surface of a ring-type pad down to a desired depth in the multi-layer structure. The via hole is cleaned and then filled with a conductive material. The via so formed between two or more substrates is self-aligned by using the ring pad(s). This contributes to an increased signal routing density compared to conventional methods.
Claims18
A method of fabricating a multi-layer substrate, comprising:
- providing a first substrate element having an upper and a lower surface and a conductive pad arranged on the upper surface of the element, wherein the conductive pad is in the form of at least a portion of a ring;
- providing a second substrate element having an upper and a lower surface and a conductive pad arranged on each of the upper and lower surfaces, and a conductive via which connects the conductive pads on the upper and the lower surfaces of the second substrate element;
- vertically aligning the conductive pad of the first substrate element to the conductive pad of the second substrate element;
- laminating the first substrate element to the second substrate element;
- drilling a via hole extending through the conductive pad of the first substrate element to the conductive pad of the second substrate element, wherein the conductive pad of the second substrate element stops the drilling;
- and
- filling the via hole with a conductive material.
A method of fabricating a multi-layer substrate, comprising:
- providing a first substrate element having opposing surfaces and a ring-shaped pad at one of the opposing surfaces, wherein the first substrate element is a G- or V-type substrate;
- providing a second substrate element having opposing surfaces and a conductive pad at one of the surfaces of the second substrate element, wherein the second substrate element is a S-type substrate;
- aligning the ring-shaped conductive pad of the first substrate element to the conductive pad of the second substrate element;
- laminating the first substrate element to the second substrate element to form a laminated structure, wherein the ring-shaped pad of the first substrate element is at an outer surface of the laminated structure and the conductive pad of the second substrate element is buried within the laminated structure;
- forming a via hole extending through the ring-shaped conductive pad of the first substrate element to the conductive pad of the second substrate element so that the via hole stops at the conductive pad on the second substrate element;
- and
- filling the via hole with a conductive material.
Dependencies are inferred from the claim text.