Apparatus and method for transporting wafers
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsC. Y. Huang, T. H. Ding
Life of this patent
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Abstract
An apparatus and a method for transporting wafers into a process chamber are disclosed. The wafer-transporting blade for transporting wafers consists of a generally elongated blade member that has a top surface for engaging and holding a wafer positioned thereon, wherein at least a portion of the top surface is provided with a surface roughness sufficiently great to frictionally engaging a wafer positioned thereon without slippage. The surface roughness may be provided by either a mechanical or a chemical method.
Claims17
An apparatus for transporting substrates comprising:
- a generally rectangular-shaped member having a recessed top surface for engaging and holding a substrate thereon,
- the recessed top surface being surrounded at two ends by two first raised peripheral portions and two second raised peripheral portions surround the first raised peripheral portions,
- the first raised peripheral portions being provided with a surface roughness sufficiently great to prevent a substrate held thereon from slipping off the surface when the substrate-transporting member is moved into a process chamber.
A wafer-transporting blade for transporting wafers into a process chamber comprising:
- a generally elongated blade member having a top recessed surface for engaging and holding a wafer securely thereon,
- the recessed top surface being surrounded at two ends by two firsts raised peripheral portions and two second raised peripheral portions surrounding the first raised peripheral portions
- the first raised peripheral portions being provided with a surface roughness formed by a multiplicity of fused sand particles or by a multiplicity of linear grooves for frictionally engaging a wafer positioned thereon without slippage.
Dependencies are inferred from the claim text.