US 6,184,749 B2Granted

Layout for pull-up/pull-down devices of off-chip driver

AssigneeVanguard International Semiconductor Corporation

InventorTzu-Che Hsiao

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Abstract

A type of wiring layout for pull-up and pull-down devices of an off-chip driver. This type of wiring layout is simpler and does not require the reservation of wiring space between neighboring bonding pads. Hence, layout area can be greatly reduced. In addition, even when the distance of separation between the pull-up device or the pull-down device and the bonding pad is great, no additional layout area is needed. Since the length of conductive wires for connecting to the pull-up or pull-down devices is much shorter, signal transmission speed is also increased.

Claims4

Dependent claims

A type of wiring layout for pull-up and pull-down devices of an off-chip driver, comprising:

a first bonding pad;
a second bonding pad located next to the first bonding pad;
a first pull-up driver on a lower side of the first bonding pad for providing a first pull-up voltage to the first bonding pad;
a first pull-down driver on a right side of the first pull-up driver for providing a first pull-down voltage to the first bonding pad;
a second pull-up driver on an upper side of the second bonding pad for providing a second pull-up voltage to the second bonding pad;
a second pull-down driver on a left side of the second pull-up driver for providing a second pull-down voltage to the second bonding pad;
a first pull-up signal line at a lower side of the first pull-up driver, wherein through a first pull-up conductive wire, the first pull-up signal line is connected to the first pull-up driver for providing the first pull-up voltage to active devices inside the first pull-up driver so that the first pull-up driver is pulled to a first high potential;
a first pull-down signal line at a lower side of the first pull-down driver, wherein through a first pull-down conductive wire, the first pull-down signal line is connected to the first pull-down driver for providing the first pull-down voltage to active devices inside the first pull-down driver so that the first pull-down driver is pulled to a first low potential;
a second pull-up signal line at an upper side of the second pull-up driver, wherein through a second pull-up conductive wire, the second pull-up signal line is connected to the second pull-up driver for providing the second pull-up voltage to active devices inside the second pull-up driver so that the second pull-up driver is pulled to a second high potential;
and
a second pull-down signal line at the upper side of the second pull-down driver, wherein through a second pull-down conductive wire, the second pull-down signal line is connected to the second pull-down driver for providing the second pull-down voltage to active devices inside the second pull-down driver so that the second pull-down driver is pulled to a second low potential.

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Dependencies are inferred from the claim text.

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Abstract

A type of wiring layout for pull-up and pull-down devices of an off-chip driver, comprising:

a first bonding pad;
a second bonding pad located next to the first bonding pad;
a first pull-up driver on a lower side of the first bonding pad for providing a first pull-up voltage to the first bonding pad;
a first pull-down driver on a right side of the first pull-up driver for providing a first pull-down voltage to the first bonding pad;
a second pull-up driver on an upper side of the second bonding pad for providing a second pull-up voltage to the second bonding pad;
a second pull-down driver on a left side of the second pull-up driver for providing a second pull-down voltage to the second bonding pad;
a first pull-up signal line at a lower side of the first pull-up driver, wherein through a first pull-up conductive wire, the first pull-up signal line is connected to the first pull-up driver for providing the first pull-up voltage to active devices inside the first pull-up driver so that the first pull-up driver is pulled to a first high potential;
a first pull-down signal line at a lower side of the first pull-down driver, wherein through a first pull-down conductive wire, the first pull-down signal line is connected to the first pull-down driver for providing the first pull-down voltage to active devices inside the first pull-down driver so that the first pull-down driver is pulled to a first low potential;
a second pull-up signal line at an upper side of the second pull-up driver, wherein through a second pull-up conductive wire, the second pull-up signal line is connected to the second pull-up driver for providing the second pull-up voltage to active devices inside the second pull-up driver so that the second pull-up driver is pulled to a second high potential;
and
a second pull-down signal line at the upper side of the second pull-down driver, wherein through a second pull-down conductive wire, the second pull-down signal line is connected to the second pull-down driver for providing the second pull-down voltage to active devices inside the second pull-down driver so that the second pull-down driver is pulled to a second low potential.

8 more elements