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US 6,184,569 B2Granted
Semiconductor chip inspection structures
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKazuyoshi Fukuda
Life of this patent
Estimating the term…
Abstract
An external inputting/outputting line connecting an external connection pad with an internal circuit is located along a peripheral edge of a semiconductor chip, between the edge and the external connection pad.
Claims4
A semiconductor chip comprising:
- an external connection pad for establishing electrical connection with an external circuit device;
- an internal circuit connected to said external connection pad for performing a specific operation;
- and
- an external inputting/outputting line connecting said external connection pad with said internal circuit wherein said external inputting/outputting line passes along a corner and between a peripheral edge of said semiconductor chip and said external connection pad.
1 more element
A semiconductor chip comprising:
- an external connection pad for establishing electrical connection with an external circuit device;
- an internal circuit connected to said external connection pad for performing a specific operation;
- an external inputting/outputting line connecting said external connection pad with said internal circuit;
- a plurality of power supply pads for supplying an identical power supply voltage;
- a peripheral edge power supply line passing between a peripheral edge of said semiconductor chip and said external connection pad connecting said plurality of power supply pads to each other;
- and
- a power supply lead-in line for supplying power to said internal circuit from said peripheral edge power supply line.
4 more elements
Dependencies are inferred from the claim text.