Field effect transistor and method of fabricating the same
AssigneeNEC Corporation
InventorKazuhiko Onda
Life of this patent
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Abstract
There is provided a field effect transistor including a semi-insulating semiconductor substrate formed with a recess at a region in which a gate is to be formed, a gate base layer formed on the recess and composed of one of an InP layer and a plurality of layers including an InP layer, and a gate electrode formed on the gate base layer. The InP layer may be replaced with an InGaP layer, an AlXGa1−XAs (0≦X≦1) layer, an InXGa1−XAs (0≦X≦1) layer, or an InXAl1−XAs (0≦X<0.4 or 0.6<X≦1) layer. The above-mentioned field effect transistor prevents thermal instability thereof caused by impurities such as fluorine entering a donor layer to thereby inactivate donor. As a result, there is presented a highly reliable compound field effect transistor.
Claims15
A field effect transistor comprising:
- a semi-insulating semiconductor substrate;
- an epitaxial, layered structure on said substrate and having a recess therein at a region in which a gate is to be formed, said layered structure comprising an impurity doped top layer and an undoped layer directly beneath said top layer, said recess extending completely through said top layer and into, but not through, said undoped layer;
- a gate base layer formed directly on portions of said top layer and said undoped layer exposed in said recess, said gate base layer comprising an InXAl1−XAs (0≦X<0.4 or 0.6<X≦1) layer;
- and
- a gate electrode formed on said gate base layer.
A field effect transistor comprising:
- a semi-insulating semiconductor substrate;
- an epitaxial, layered structure on said substrate and having a recess therein at a region in which a gate is to be formed, said layered structure comprising an impurity doped top layer and an undoped layer directly beneath said top layer, said recess extending completely through said top layer and into, but not through, said undoped layer;
- a gate base layer formed directly on portions of said top layer and said undoped layer exposed in said recess, said gate base layer comprising a plurality of layers including an InXAl1−XAs (0≦X<0.4 or 0.6<X≦1) layer;
- and
- a gate electrode formed on said gate base layer, wherein a portion of said gate base layer extends beyond a periphery of said recess and is directly on a top surface of said top layer adjacent to said recess.
A field effect transistor comprising:
- a semi-insulating semiconductor substrate;
- an epitaxial, layered structure on said substrate and having a recess therein at a region in which a gate is to be formed, said layered structure comprising an impurity doped top layer and an undoped layer directly beneath said top layer, said recess extending completely through said top layer and into, but not through, said undoped layer;
- a gate base layer formed directly on portions of said top layer and said undoped layer exposed in said recess, said gate base layer comprising one of a plurality of layers including an InXAl1−XAs (0≦X<0.4 or 0.6<X≦1) layer;
- and
- a gate electrode formed on said gate base layer.
Dependencies are inferred from the claim text.