Apparatus for thermally processing semiconductor wafer
AssigneeSumitomo Electric Industries, Ltd.
InventorMakoto Kiyama
Life of this patent
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Abstract
An apparatus for thermally processing a semiconductor wafer includes a susceptor to support the wafer, a heater arrangement to differentially heat the wafer and provide a temperature distribution on said wafer, a radiation thermometer for measuring the temperature distribution, and means for controlling and varying the temperature distribution. The heater arrangement particularly includes a first heater to heat an edge of the wafer, around a second heater to heat a center area of the wafer. With this apparatus, the rate of change of the temperature and the temperature distribution of the wafer can be controlled within tolerable limits to avoid slip line generation. Also, the relative stress state of the wafer edge and the wafer center can be influenced by differential heating of the edge and the center.
Claims3
An apparatus for thermally processing a semiconductor wafer, comprising:
- a susceptor for supporting a semiconductor wafer;
- heating means for providing a temperature distribution to said semiconductor wafer;
- means for measuring said temperature distribution of said semiconductor wafer;
- means for calculating a maximum thermal stress σθ(R) in a major plane of said semiconductor wafer based on said temperature distribution of said semiconductor wafer;
- and
- means for controlling said temperature distribution so that said maximum thermal stress σθ(R) does not exceed a critical stress for slip defect generation, wherein said critical stress is defined with a value 0.046 exp(0.38 eV/kT)MPa.
Dependencies are inferred from the claim text.