Method of supplying a chemical mechanical polishing liquid and apparatus therefor
AssigneeNEC Corporation
InventorHidemitsu Aoki
Life of this patent
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Abstract
The first present invention provides an apparatus for activating a polishing liquid including polishing particles and hydrogen peroxide for carrying out a chemical mechanical polishing method to a surface of a wafer to be polished, wherein the apparatus comprises an ultraviolet ray irradiation system for an irradiation of an ultraviolet ray to the polishing liquid.
Claims16
An apparatus for activating a polishing liquid including polishing particles and hydrogen peroxide for carrying out a chemical mechanical polishing method to a surface of a wafer to be polished, comprising
- a tube transparent to an ultraviolet ray for allowing said polishing liquid to be flowed through said tube and for isolating said polishing liquid from an atmosphere;
- and
- an ultraviolet ray irradiator provided outside of said tube for irradiating an ultraviolet ray through said tube onto said polishing liquid.
A chemical mechanical polishing system comprising:
- a reservoir for reserving a polishing liquid including polishing particles and hydrogen peroxide;
- a polishing pad for carrying out a chemical mechanical polishing to a wafer;
- a polishing liquid feeding system connected to said reservoir for feeding said polishing liquid onto said polishing pad;
- a tube transparent to an ultraviolet ray for allowing said polishing liquid to be flowed through said tube and for isolating said polishing liquid from an atmosphere;
- and
- an ultraviolet ray irradiator provided outside of said tube for irradiating an ultraviolet ray through said tube onto said polishing liquid.
A method of supplying a polishing liquid including polishing particles and hydrogen peroxide for carrying out a chemical mechanical polishing method to a surface of a wafer to be polished comprising,
- subjecting said polishing liquid to an irradiation by an ultraviolet ray and applying said polishing liquid onto a polishing surface of said wafer.
Dependencies are inferred from the claim text.