I.C. carrier insert
AssigneeJohnstech International Corporation
InventorsWilliam S. Clark, Donald L. Fulcher, David A. Johnson, Martin L. Cavegn, Chad Van Hove, John E. Nelson
Life of this patent
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Abstract
An insert for use within integrated circuit (IC) chip carriers to provide universality across device types and applications at a low design and fabrication cost. The present invention functions as a generic carrier floor and/or adaptor insert which enables reception of both quad-flat-pack (QFP) and thin-quad-flat-pack (TQFP) ICs within frames of a variety of existing carriers, or alternatively, may allow both QFP and TQFP ICs to utilize a single IC carrier frame, a feature which currently prevailing embodiments would require two unique IC carriers.
Claims11
Apparatus for use in testing integrated circuit chips comprising:
- a) an integrated circuit chip carrier having an interior in which an integrated circuit chip including a plurality of leads is received;
- and
- b) an insert arranged to engage and partially enclose an integrated circuit chip, said insert being formed from an initially planar malleable blank including:
- (i) at least one portion bendable over a corresponding ridge of the chip carrier to secure said blank to the chip carrier with said blank having at least one window formed therethrough;
- and
- (ii) when an integrated circuit chip, engaged by said blank, is received in the interior of the chip carrier and said blank is secured to the chip carrier, at least one of said window overlying at least one of the integrated circuit leads to expose the at least one of the integrated circuit leads.
Dependencies are inferred from the claim text.