Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs
AssigneeDsm N. V.
InventorsChau Thi Minh Ha, Michael G. Sullivan
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Abstract
Cationic and hybrid radiation-curable pressure sensitive adhesive compositions for digital versatile discs and other substrates, a method for bonding versatile digital disc layers together with a cationic or hybrid radiation-curable pressure sensitive adhesive, and a digital versatile disc bonded by cationic or hybrid radiation-curable pressure sensitive adhesive.
Claims30
A radiation-curable hybrid free radical and cationic pressure sensitive adhesive composition for bonding digital versatile disc components comprising the combination of the following pre-mixture ingredients:
- (A) about 10 wt. % to about 70 wt. % of at least one radiation-curable acrylate oligomer;
- (B) about 0 wt. % to about 30 wt. % of at least one reactive diluent;
- (C) about 0 wt. % to about 15 wt. % of at least one free radical photoinitiator,
- (D) about 10 wt. % to about 99 wt. % of at least one epoxy resin;
- (E) about 0 wt. % to about 20 wt. % of at least one diol;
- (F) about 0.5 wt. % to about 15 wt. % of at least one cationic photoinitiator;
- and
- (G) γ-mercaptopropyltrimethoxysilane.
A hybrid free radical and cationic pressure sensitive adhesive composition comprising:
- (A) about 10 wt. % to about 50 wt. % of at least one radiation-curable acrylate oligomer;
- (B) about 1 wt. % to about 30 wt. % of at least one reactive diluent;
- (C) about 0.5 wt. % to about 5 wt. % of at least one free radical photoinitiator,
- (D) about 10 wt. % to about 50 wt. % of at least one bisphenol-F epoxy resin;
- (E) about 1 wt. % to about 20 wt. % of at least one diol;
- (F) about 0.5 wt. % to about 5 wt. % of at least one cationic photoinitiator;
- and
- (G) optionally, at least one additional additive.
A radiation-curable hybrid free radical and cationic pressure sensitive adhesive composition comprising the combination of the following pre-mixture ingredients:
- (A) about 0 wt. % to about 70 wt. % of at least one radiation-curable acrylate oligomer;
- (B) about 0 wt. % to about 30 wt. % of at least one reactive diluent;
- (C) about 0 wt. % to about 15 wt. % of at least one free radical photoinitiator,
- (D) about 10 wt. % to about 99 wt. % of at least one epoxy resin;
- (E) about 0 wt. % to about 20 wt. % of at least one diol;
- (F) about 0.5 wt. % to about 15 wt. % of at least one cationic photoinitiator;
- and
- (G) γ-mercaptopropyltrimethoxysilane.
A composition comprising:
- (A) about 10 wt. % to about 50 wt. % of at least one radiation-curable acrylate oligomer;
- (B) about 1 wt. % to about 30 wt. % of at least one reactive diluent;
- (C) about 0.5 wt. % to about 5 wt. % of at least one free radical photoinitiator,
- (D) about 10 wt. % to about 50 wt. % of at least one bisphenol-F epoxy resin;
- (E) about 1 wt. % to about 20 wt. % of at least one diol;
- (F) about 0.5 wt. % to about 5 wt. % of at least one cationic photoinitiator;
- and
- (G) optionally, at least one additional additive.
A method of bonding digital versatile disc layers, comprising bonding at least two of the layers of the disc with a radiation-curable hybrid free radical and cationic pressure sensitive adhesive composition comprising:
- (A) about 0 wt. % to about 70 wt. % of at least one radiation-curable acrylate oligomer;
- (B) about 0 wt. % to about 30 wt. % of at least one reactive diluent;
- (C) about 0 wt. % to about 15 wt. % of at least one free radical photoinitiator,
- (D)about 10 wt. % to about 99 wt. % of at least one epoxy resin;
- (E) about 0 wt. % to about 20 wt. % of at least one diol;
- (F) about 0.5 wt. % to about 15 wt. % of at least one cationic photoinitiator;
- and
- (G) optionally, at least one additional additive.
A bonded digital versatile disc comprising a digital versatile disc formed of at least two layers, a first said layer being bonded to a second said layer by a radiation-cured hybrid free radical and cationic pressure sensitive adhesive composition, wherein a pre-mixture formulation of said hybrid pressure sensitive adhesive composition comprises:
- (A) about 0 wt. % to about 70 wt. % of at least one radiation-curable acrylate oligomer;
- (B) about 0 wt. % to about 30 wt. % of at least one reactive diluent;
- (C) about 0 wt. % to about 15 wt. % of at least one free radical photoinitiator,
- (D) about 10 wt. % to about 99 wt. % of at least one epoxy resin;
- (E) about 0 wt. % to about 20 wt. % of at least one diol;
- (F) about 0.5 wt. % to about 15 wt. % of at least one cationic photoinitiator;
- and
- (G) optionally, at least one additional additive;
- wherein the shear strength of a cured disc is from about 10 lbs to about 100 lbs.
Dependencies are inferred from the claim text.