US 6,176,995 B1 · Method and apparatus for electrolytically metallizing or etching material

Abstract

The current density with which the process is used is of essential importance for the economy of a method of electrolytically treating materials. Normally only low or medium current densities are used, as the speed of replacement of consumed materials in the direct vicinity of the surface of the material for treatment has a restrictive effect on the magnitude of the current density at which a usable process result can still be achieved. However, a low current density leads to long electrolysis times and to complex treatment installations. The opportunity afforded according to the invention of improving the transfer of materials at the surface of the material for treatment consists in generating a large flow of electrolyte at the treatment point by means of rotating electrodes which are movable synchronously with the surfaces of the material for treatment, and which may be electrically polarized with respect to the material for treatment, out of which the treatment agent emerges through openings, or into which it is sucked through openings.

Claims34

Dependent claims

The method for electrolytically metallizing or etching perforated printed circuit boards having holes therein with a selected current density, comprising the steps of:

(a) bringing printed circuit boards and at least one partly hollow electrode, with surface openings therein, into contact with a treatment agent;
(b) polarizing the at least one electrode electrically relative to the printed circuit boards;
(c) moving the printed circuit boards in a linear path of travel at a preset speed;
(d) moving the at least one electrode in a rotating fashion with its periphery at a tangential speed equal to said predetermined speed;
(e) supplying the treatment agent through the at least one partly hollow electrode;
(f) wherein the step of supplying treatment agent includes passing the treatment agent under relative pressure through the openings in the at least one electrode while printed circuit boards are moved opposite the openings, so that the direction of flow of the treatment agent is only transverse to the path of travel of the printed circuit boards relative to holes of the printed circuit boards;
and
(g) wherein the step of passing the treatment agent through the at least one electrode includes suctioning the treatment agent through the at least one electrode.

5 more elements

An apparatus for electrolytically metallizing or etching perforated printed circuit boards provided with holes, comprising:

(a) at least one hollow electrode adapted to be polarized as anode or cathode relative to the printed circuit boards;
(b) a power supply for the at least one electrode and the printed circuit boards;
(c) means for rotationally moving the at least one electrode;
(d) means for supplying treatment agent to one of
(i) the hollow at least one electrode with further means for discharging treatment agent from the at least one electrode to the openings in the printed circuit boards;
and
(ii) the surfaces of the printed circuit boards with further means for extracting the treatment agent by suction from the printed circuit boards through openings in the at least one electrode;
(e) means for moving the printed circuit boards and the at least one electrode in a linear path of travel while the at least one electrode is moved rotationally, with said movements of said at least one electrode and printed circuit boards being synchronous to each other;
and
(f) storage container means for the treatment agent;
(g) wherein the at least one electrode is generally cylindrically configured and disposed along the path of travel of the printed circuit boards and in transverse relation thereto, and with the at least one electrode having openings therein and including a flexible treatment agent flow line connected to the at least one electrode, and with a cover enveloping the at least one electrode;
said cover having a treatment agent passage open only towards the path of travel of the printed circuit boards.

9 more elements

An apparatus for electrolytically metallizing or etching perforated printed circuit boards provided with holes, comprising:

(a) at least one hollow electrode adapted to be polarized as anode or cathode relative to the printed circuit boards;
(b) a power supply for the at least one electrode and the printed circuit boards;
(c) means for rotationally moving the at least one electrode;
(d) means for supplying treatment agent to one of
(i) the hollow at least one electrode with further means for discharging treatment agent from the at least one electrode to the openings in the printed circuit boards;
and
(ii) the surfaces of the printed circuit boards with further means for extracting the treatment agent by suction from the printed circuit boards through openings in the at least one electrode;
(e) means for moving the printed circuit boards and the at least one electrode in a linear path of travel while the at least one electrode is moved rotationally, with said movements of said at least one electrode and printed circuit boards being synchronous to each other;
and
(f) storage container means for the treatment agent;
and
(g) wherein the at least one electrode carries a non-rotatable electrolyte tube situated in the at least one electrode, with electrolyte passway means disposed to face a surface of a printed circuit board.

9 more elements

The method for electrolytically metallizing or etching perforated printed circuit boards having holes therein with a selected current density, comprising the steps of:

(a) bringing printed circuit boards and at least one partly hollow electrode, with surface openings therein, into contact with a treatment agent;
(b) polarizing the at least one electrode electrically relative to the printed circuit boards;
(c) moving the printed circuit boards in a linear path of travel at a preset speed;
(d) moving the at least one electrode in a rotating fashion with its periphery at a tangential speed equal to said predetermined speed;
(e) supplying the treatment agent through the at least one partly hollow electrode;
and
(f) wherein the step of supplying treatment agent includes passing the treatment agent under relative pressure through the openings in the at least one electrode while printed circuit boards are moved opposite the openings, so that the direction of flow of the treatment agent is only transverse to the path of travel of the printed circuit boards relative to holes of the printed circuit boards;
(g) wherein there are a plurality of electrodes provided, at least one on each side of the path of travel of printed circuit boards, and wherein treatment agent emerges though holes in the printed circuit boards in a forced manner by means of positive pressure treatment agent flow from at least one electrode on one side of the path of travel of printed circuit boards, and wherein treatment agent is extracted by suction through openings in at least one suction electrode situated on the opposite side of the path of travel of printed circuit boards.

5 more elements

The method for electrolytically metallizing or etching perforated printed circuit boards having holes therein with a selected current density, comprising the steps of:

(a) bringing printed circuit boards and at least one partly hollow electrode, with surface openings therein, into contact with a treatment agent;
(b) polarizing the at least one electrode electrically relative to the printed circuit boards;
(c) moving the printed circuit boards in a linear path of travel at a preset speed;
(d) moving the at least one electrode in a rotating fashion with its periphery at a tangential speed equal to said predetermined speed;
(e) supplying the treatment agent through the at least one partly hollow electrode;
and
(f) wherein the step of supplying treatment agent includes passing the treatment agent under relative pressure through the openings in the at least one electrode while printed circuit boards are moved opposite the openings, so that the direction of flow of the treatment agent is only transverse to the path of travel of the printed circuit boards relative to holes of the printed circuit boards;
(g) wherein the step of supplying a treatment agent comprises supplying the printed circuit boards with a metallizing solution as the treatment agent, wherein there are provided a plurality of electrodes, wherein the plurality of electrodes are disposed one behind the other along the path of travel of printed circuit boards, wherein the printed circuit boards are moved past the plurality of electrodes, wherein the electrodes are alternately polarized as anode or cathode with respect to the printed circuit boards, and wherein the printed circuit boards in their movement along their path of travel past the electrodes are respectively metallized and partly demetallized.

5 more elements

Dependencies are inferred from the claim text.

Method and apparatus for electrolytically metallizing or etching material

Life of this patent

Method and apparatus for electrolytically metallizing or etching material

Life of this patent

Abstract

Claims34