Method and device for stacking substrates which are to be joined by bonding
AssigneeMannesmann Kienzle GmbH
InventorsHorst Plankenhorn, Thomas Lindner
Life of this patent
Estimating the term…
Abstract
A method and an apparatus are proposed in order to bond multilayered substrate packages over a large surface at uniform heating in the course of one single work step, wherein the structured substrates are to begin with aligned to one another with high precision to correspond to the structuring in a working area separate from the heating apparatus.
Claims8
A method of stacking a plurality of structured substrates to be aligned with one another corresponding to structuring thereof and connected undetachably to one another by bonding, with the substrates having approximately same surface area and with at least one substrate being non-transparent, said method comprising the steps of:
- providing a substrate handling device having spaced first and second working areas and substrate receiving means provided at each of the first and second working areas;
- aligning the substrates in the first working area of the handling device, said aligning step including directing a microscope upon substrates, arranged on the receiving means of the first working area, for generating two spatially separated alignment marks of a substrate on an image carrier, with the alignment marks being formed by one of active structures of the substrate itself and by independent markings, and changing an actual position of the substrate by rotating and displacing the receiving means until an image of the alignment marks coincides with a nominal position present upon the image carrier;
- thereafter, transporting the substrates to the second working area of the handling device and depositing the substrates one upon another in accordance with alignment thereof to form a substrate package;
- and
- transporting the substrate package to a heating device for uniform heating of all sides of the package to effect simultaneous bonding of the substrates in a single work step.
An apparatus for stacking a plurality of structured substrates to be aligned with one another corresponding to structuring thereof and connected undetachably to one another by bonding, with the substrates having approximately same surface area and with at least one substrate being non-transparent, said apparatus comprising:
- a substrate handling device having spaced first and second working areas;
- first means for receiving and retaining a substrate in said first working area of the handling means;
- alignment means located in said first working area for supporting said first receiving and retaining means, said alignment means comprising a coordinate table having precision drive means for effecting displacement of said first receiving and retaining means along three mutually perpendicular coordinates for changing an actual position of the substrate supported in said first receiving and retaining means for aligning the substrate;
- microscope means provided in said first working area for imaging two spatially separated alignment marks on the substrate supported in said first receiving and retaining means;
- second means located in said second working area for receiving and retaining aligned substrates to be deposited one upon another;
- means for transporting the substrates aligned in said first working area to said second working area and for depositing the aligned substrates onto said second receiving and retaining means one upon another in accordance with alignment effected in said first working area;
- and
- means for uniformly heating on all sides a substrate package formed in said second working area for effecting simultaneous bonding of the substrates of the package in a single working step.
Dependencies are inferred from the claim text.