Printed circuit board having wire clamps for securing component leads
AssigneeU.S. Philips Corporation
InventorSteven J. W. Van Lerberghe
Life of this patent
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Abstract
A printed circuit board is provided with at least one component having one or more leads which are secured to contact faces of the printed circuit board. The leads of the component are secured to the printed circuit board via wire clamps soldered onto the surface of the contact faces. The formation of through-holes in the printed circuit board is rendered superfluous by the wire clamps. For the leaded components use can be made of resistors and capacitors, but also of a single electroconductive wire. Also described is a method of manufacturing the invented printed circuit board.
Claims17
A printed circuit board provided with at least one component having one or more wire leads extending from the component which are secured to contact faces of the printed circuit board, wherein the leads of the component are secured to the printed circuit board via wire clamps soldered directly onto the surface of the contact faces.
A method of securing to a printed circuit board a component having one or more wire leads extending from the component, the method comprising:
- securing at least one lead of the component to a wire clamp, and soldering the wire clamp directly onto the surface of a contact face of the printed circuit board thereby to secure said one lead of the component to the surface of said contact face via the wire clamp.
A printed circuit board comprising:
- an electric insulating substrate,
- at least one electroconductive track on a surface of said substrate, said electroconductive track having a contact face for conduction of an electric current,
- at least one electric circuit component on the substrate and having one or more wire leads extending therefrom,
- at least one electroconductive wire clamp secured to one wire lead of the electric circuit component and secured to the contact face to provide a current path between the electric circuit component and the relevant electroconductive track of said contact face and by which the electric circuit component is secured to the surface of the substrate.
Dependencies are inferred from the claim text.