Single mount and cooling for two two-sided printed circuit boards
AssigneeAlliedSignal Inc.
InventorScott Hoffman
Life of this patent
Estimating the term…
Abstract
A mounting plate for two printed circuit boards. The mounting plate formed of a layer of thermally conductive material with securing mechanisms fixing one of the two printed circuit boards in a spaced away relationship with each surface of the mounting plate.
Claims29
A mounting plate for two printed circuit boards, the mounting plate comprising:
- a layer of thermally conductive material having first and second substantially planar surfaces disposed substantially parallel to each other;
- and
- at least one securing mechanism coupling the two printed circuit boards to said layer of thermally conductive material, wherein at least one of the printed circuit boards is fixed in a spaced away relationship with each of said first and second planar surfaces.
A mounting plate for two printed circuit boards, the mounting plate comprising:
- a plate formed of thermally conductive material, said plate having opposing substantially planar surfaces disposed substantially parallel to each other and a length dimension L1 greater than a length dimension L2 corresponding to at least one of the two printed circuit boards;
- a plurality of spacers disposed on each of said opposing planar surfaces, each said spacer having a distal end spaced a predetermined distance away from a respective one of said opposing planar surfaces;
- and
- at least one securing mechanism coupling the two printed circuit boards to said distal end of said spacers on each side of said layer of thermally conductive material, whereby at least one of the two printed circuit boards is fixed in a spaced away relationship with each of said opposing planar surfaces.
An electronic circuit assembly comprising:
- A heat conducting mounting plate having substantially planar opposing surfaces disposed substantially parallel to each other;
- two printed circuit boards disposed in a spaced away and essentially parallel relationship with each of said planar surfaces;
- and
- at least one securing mechanism coupling said printed circuit boards in said relationship with each of said planar surfaces.
A method for dissipating heat generated by two printed circuit boards having one or more heat generating components installed thereon, the method comprising the steps of:
- orienting a surface of one of the printed circuit boards having one or more heat generating components installed thereon in a facing relationship with one of two substantially planar opposing surfaces of a thermally conductive plate;
- and
- fixing the two printed circuit boards to said thermally conductive plate surfaces, wherein at least one of the printed circuit boards is fixed in a spaced away relationship with a corresponding one of said two planar opposing surfaces
- such that generated heat is absorbed from the printed circuit boards into said thermally conductive plate.
An electronics enclosure for use with a thermally conductive mounting plate formed of two thermally conductive plates joined together at first substantially planar surfaces having fins projecting therefrom and having two printed circuit boards fixed in a spaced away relationship with second opposing substantially planar surfaces, the electronics enclosure comprising:
- at least two opposing walls joined in a spaced apart relationship;
- slots formed in said walls, said slots sized to accept the thermally conductive mounting plate;
- and
- windows formed in said walls adjacent said slots and aligned with the fins of an installed thermally conductive mounting plate.
Dependencies are inferred from the claim text.