Inspection method and apparatus for projection optical systems
AssigneeNikon Corporation
InventorsTetsuo Taniguchi, Toshihiko Tsuji
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AssigneeNikon Corporation
InventorsTetsuo Taniguchi, Toshihiko Tsuji
Estimating the term…
The present invention relates to a method of detecting an image formation characteristic of a projection optical system for projecting a reference pattern on a reticle on a substrate. According to the detection method, a reticle stage is moved so that a reference mark on the reticle comes to a first reference position and a second reference position, and a wafer stage is moved so that a light transmission portion on the wafer stage crosses an image forming position of a projected image of the reference mark obtained through the projection optical system. The positions of the reticle stage and the wafer stage at the first and second reference positions are measured as moved distances of the stages, respectively. From the distances of movement of the reticle and wafer stages measured, the image formation characteristic of the projection optical system is calculated.
An inspection method of a projection optical system for projecting an image of a pattern on a mask onto a predetermined plate, comprising the steps of:
A projection exposure method in which an image of a pattern formed on a mask is projected onto a substrate through a projection system, the method comprising:
A projection exposure method in which an image of a pattern formed on a mask is projected onto a substrate through a projection system, the method comprising:
A projection exposure method in which a pattern formed on a mask is transferred onto a substrate through a projection system, the method comprising:
A projection exposure method in which a pattern formed on a mask is transferred onto a substrate through a projection system, the method comprising:
A projection exposure method in which a pattern formed on a mask is transferred onto a substrate through a projection system, the method comprising:
A projection exposure method in which an image of a pattern formed on a mask is projected onto a substrate through a projection system, the method comprising:
A projection exposure method in which an image of a pattern formed on a mask is projected onto a substrate through a projection system, the method comprising:
A projection exposure method in which an image of a pattern formed on a mask is projected onto a substrate through a projection system, the method comprising:
A projection exposure method in which an image of a pattern formed on a mask is projected onto a substrate through a projection system, the method comprising:
A projection exposure method in which a pattern of a mask is transferred onto a substrate through a projection optical system, the method comprising:
A scanning exposure method in which a mask and a substrate are moved synchronously for a scanning exposure, the method comprising:
A projection exposure method in which a pattern of a mask is transferred onto a substrate through a projection optical system, the method comprising the steps of:
A method for making a projection exposure apparatus which transfers a pattern formed on a mask onto a substrate, the method comprising:
A method for making a scanning exposure apparatus which transfers a pattern formed on a mask onto a substrate through a projection system by synchronously moving said substrate and said mask in respective scanning directions, the method comprising:
A method for making a projection exposure apparatus which transfers a pattern formed on a mask onto a substrate through a projection optical system, the method comprising:
A method for making a projection exposure apparatus in which an image of a pattern formed on a mask is projected onto a substrate through a projection system, the method comprising:
Dependencies are inferred from the claim text.