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US 6,150,712 AGranted
Lead frame for semiconductor device, and semiconductor device
AssigneeSony Corporation
InventorsYuji Himeno, Kouji Mizota
Life of this patent
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AssigneeSony Corporation
InventorsYuji Himeno, Kouji Mizota
Estimating the term…
Disclosed are a lead frame for a semiconductor device, and a semiconductor device using the lead frame. Inner leads and outer leads of the lead frame are formed to have such a sectional structure that a film of Pd or a Pd alloy is formed on both surfaces or a rear surface of a lead frame directly or through an undercoat, and an Au-plated film is formed on a part of the film of Pd or a Pd alloy. Pd and Au are not applied to unnecessary areas, thus resulting in higher economical and production efficiency. The lead frame has good quality, is economical and has superior productivity. Wires connecting a semiconductor chip and the inner leads have a good connection property and joint portions of the outer leads to an external device also have a good connection property.
A lead frame comprising a die pad, a guide rail, outer leads and inner leads, said lead frame having a material surface on which a film of a metal or a metal alloy is formed, wherein said film of a metal or a metal alloy is not formed on at least a rear surface of said die pad,
A lead frame comprising a die pad, a guide rail, outer leads and inner leads, said lead frame having a material surface on which a film of a metal or a metal alloy is formed, wherein a gold film is formed on said film of a metal or a metal alloy on only a rear surface of said lead frame.
A semiconductor device comprising a lead frame with a semiconductor chip mounted on a die pad, said semiconductor chip being resin-molded in a condition electrically connected to inner leads of said lead frame, outer leads of said lead frame being extended out of a molding resin, wherein a film of a metal or a metal alloy is formed on a material surface of said lead frame, and a material surface of said die pad is not covered with said metal or said metal alloy in at least a rear surface of said die pad,
A lead frame comprising a die pad, a guide rail, outer leads and inner leads, said lead frame having a material surface on which a film of a metal or a metal alloy is formed, wherein a gold film is formed on said film of a metal or a metal alloy on only a rear surface of said lead frame,
A lead frame comprising a die pad, a guide rail, outer leads and inner leads, said lead frame having a material surface on which a film of a metal or a metal alloy is formed, wherein a gold film is formed on said film of a metal or a metal alloy on only a rear surface of said lead frame,
Dependencies are inferred from the claim text.