Method of forming an organic polymer insulating film in a semiconductor device
AssigneeNEC Corporation
InventorJun Kawahara
Life of this patent
Estimating the term…
Abstract
A method of forming an organic polymer insulator in a semiconductor device comprises the step of causing a thermal polymerization of at least one kind of monomers and oligomers supplied in vapor phase.
Claims71
A method of forming an organic polymer insulator, said method comprising the step of:
- causing a thermal polymerization of at least one kind of monomers and oligomers supplied in vapor phase;
- wherein said at least one kind of monomers and oligomers has a first structure capable of having at least two double bonds and a second structure capable of having at least one double bond upon receipt of an energy;
- and
- wherein one kind of said monomers and oligomers is polymerized and said one kind of said monomers and oligomers includes both said first structure capable of having at least two double bonds and said second structure capable of having at least one double bond upon receipt of an energy.
A method of forming an organic polymer insulating film on a solid, said method comprising the step of:
- supplying at least one kind of monomers and oligomers in vapor phase onto a surface of said solid which is heated so as to cause a thermal polymerization of said at least one kind of monomers and oligomers on said surface of said solid.
A method of forming an organic polymer insulating film over a substrate which is in one of processes for fabricating a semiconductor device, said method comprising the step of:
- supplying at least one kind of monomers and oligomers in vapor phase onto a surface of said substrate which is heated so as to cause a thermal polymerization of said at least one kind of monomers and oligomers on said surface of said substrate.
A method of forming an organic polymer inter-layer insulator over a substrate for a semiconductor device, a surface of said substrate having a base insulating film and a plurality of interconnections extending on said base insulating film, said method comprising the step of:
- supplying at least one kind of monomers and oligomers in vapor phase onto said surface of said substrate which is heated so as to cause a thermal polymerization of said at least one kind of monomers and oligomers on said surface of said solid.
A method of forming an organic polymer insulating film over a substrate which is in one of processes for fabricating a semiconductor device, said substrate being placed on a substrate holder with a heater accommodated in a reaction chamber, said method comprising the step of:
- vaporizing at least one kind of monomers and oligomers;
- feeding said at least one kind of monomers and oligomers which is kept in vapor phase into a reaction chamber;
- and
- supplying said at least one kind of monomers and oligomers which is kept in vapor phase onto a surface of said substrate which is heated by said heater so as to cause a thermal polymerization of said at least one kind of monomers and oligomers on said surface of said substrate.
Dependencies are inferred from the claim text.