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AssigneeToyo Boseki Kabushiki Kaisha
InventorsKatsumasa Yamamoto, Takamitsu Ariki, Kosaku Onodera, Masaru Nampei
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A process for treating the periphery of an unexposed photosensitive resin plate, which comprises irradiation of light having a wavelength of not longer than 300 nm on the periphery of the unexposed photosensitive resin plate until the periphery is free of stickiness. The process of the present invention solves problems such as sticking of the peripheral resin of unexposed plates to packages, sticking of unexposed resin to a working table, exposure table or vacuum adhesion sheet, sticking of dust, and so on on the periphery of unexposed plates, and sticking of unexposed resin to hands when handling, while eliminating all defects in handling during the steps of making printing plates.
A process for treating the periphery of a photosensitive resin plate that has not been previously irradiated with light, wherein said plate comprises a photocurable resin comprising (1) a polyamide, a polyvinyl alcohol, a polyester, an acrylic polymer, or a polyurethane, (2) a photopolymerizable unsaturated monomer and (3) a photosensitizer, which comprises irradiation with light having only a wavelength below 300 nm on only the periphery of the unexposed photosensitive resin plate until the periphery is free of stickiness without impairing resin photosensitivity.
Dependencies are inferred from the claim text.