Copper sputtering target
AssigneeApplied Materials, Inc.
InventorsHoward Tang, Imran Hashim, Richard Hong, Peijun Ding
Life of this patent
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Abstract
The present invention generally provides an apparatus and a method for physical vapor deposition of a metal onto a substrate comprising a physical vapor deposition chamber and a target disposed in an upper portion of the chamber. The target comprises a backing plate having a central portion and a flange portion attachable to the physical vapor deposition chamber, a sputterable portion extending from the central portion of the backing plate, and an annular ridge disposed on a surface of the flange portion. Preferably, the sputterable portion of the target includes a restriction side wall that restricts entry of plasma and back-scattered particles into the dark space gap between an upper shield and the target.
Claims34
A target for a physical vapor deposition chamber, comprising:
- a) a backing plate having a central portion and a flange portion attachable to the physical vapor deposition chamber;
- b) a sputterable portion disposed on the central portion of the backing plate;
- and
- c) an annular ridge extending from a surface of the flange portion.
An apparatus for deposition of a material onto a substrate, comprising:
- a) a physical vapor deposition chamber;
- and
- b) a target disposed on an upper portion of the chamber, comprising:
- i) a backing plate having a central portion and a flange portion attachable to the physical vapor deposition chamber;
- ii) a sputterable portion disposed on the central portion of the backing plate;
- and
- iii) an annular ridge extend from a lower surface of the flange portion.
A method for depositing a material onto a substrate, comprising:
- a) providing a physical vapor deposition chamber having a target comprising:
- i) a backing plate having a central portion and a flange portion attachable to the chamber;
- ii) a sputterable portion extending from the central portion of the backing plate;
- and
- iii) an annular ridge extending from the flange portion;
- b) surrounding the sputterable portion with an annular shield disposed below the annular ridge;
- c) shielding a gap between the flange portion and a surface of the chamber using the annular ridge;
- d) positioning the substrate within the chamber;
- and
- e) sputtering material from the sputterable portion of the target.
A target for a physical vapor deposition chamber, comprising:
- a) a backing plate having a central portion and a horizontal flange portion attachable to the physical vapor deposition chamber;
- b) a sputterable portion disposed on the central portion of the backing plate;
- and
- c) an annular ridge extending from a surface of the horizontal flange portion.
Dependencies are inferred from the claim text.