Process and device for one-sided treatment of disk-shaped objects
AssigneeSEZ Semiconductor-Equipment Zubehor fur die Halbleiterfertigung AG
InventorGunther Guggenberger
Life of this patent
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Abstract
For one-sided etching of silicon wafer 8 in the dry-etching process, a dee is provided that consists of a cap-shaped housing 1 and a holding plate 7, attached to the latter, for silicon wafer 8 that is to be etched in a process chamber 5, into which a medium in gaseous form that exerts an etching action can be introduced. In holding plate 7 is an indentation 9, around which holding pins 11 for silicon wafer 8 and suction openings 12 are arranged to remove gas from process chamber 5. Silicon wafer 8 that is to be treated is placed with its side 20 that is to be etched upward on holding plate 7, and a medium in gaseous form that is inert with respect to the layer that is to be removed by etching is introduced into indentation 9 in holding plate 7.
Claims7
Apparatus for treating a disk-shaped object, which comprises:
- a cap-shaped housing part and a holding plate which together define a processing chamber;
- said housing part including a first pipe for introducing a gaseous etching medium into said processing chamber;
- said holding plate having at least one indentation for supporting a disk-shaped object having a layer to be etched, and a second pipe for introducing a gaseous medium into said indentation;
- said gaseous medium being inert with respect to the layer to be etched;
- said indentation being circumscribed by an outer peripheral wall having an upper surface;
- said disk-shaped object having an outer peripheral lower surface adapted to engage the upper surface of the indentation, such that said indentation is smaller than the disk-shaped object;
- and
- wherein a nozzle-shaped ring gap is provided between a peripheral edge of the disk-shaped object and a surface area of the holding plate that surrounds the indentation.
Dependencies are inferred from the claim text.