Colloidal silica slurry for NiP plated disk polishing
AssigneeKomag, Inc.
InventorKang Jia
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Abstract
A novel colloidal silica slurry including additives for enhancing the removal rate of a metallic workpiece, preventing etch pits, and enhancing smoothness. These additives include HNO.sub.3, H.sub.2 O.sub.2 and Al(NO.sub.3).sub.3. In lieu of colloidal silica, colloidal alumina can be used. The metallic workpiece can be NiP, Ni, Al or other appropriate materials.
Claims18
A colloidal slurry for use in a polishing process comprising:
- aqueous colloidal silica abrasive for abrasively polishing a workpiece;
- and
- a metal nitrate salt for increasing the polishing rate during chemical mechanical polishing with said slurry, wherein said metal nitrate salt is Al(NO.sub.3).sub.3 and said slurry further comprises HNO.sub.3 and H.sub.2 O.sub.2, and wherein said HNO.sub.3 is present in an amount sufficient to prevent said colloidal silica from jelling and said H.sub.2 O.sub.2 is present in an amount sufficient to prevent pit formation when said slurry is used to polish.
A colloidal slurry for use in a polishing process comprising:
- aqueous colloidal silica abrasive for abrasively polishing a workpiece;
- and
- a metal nitrate salt for increasing the polishing rate during chemical mechanical polishing with said slurry, wherein said metal nitrate salt is Al(NO.sub.3).sub.3 and said slurry further comprises HNO.sub.3 and H.sub.2 O.sub.2, and wherein said slurry comprises between 2 and 40 wt. % silica, 0.1 and 2.5 wt. % Al(NO.sub.3).sub.3, greater than 0 wt. % but less than or equal to 1 wt. % HNO.sub.3, and between 0.1 and 3 wt. % H.sub.2 O.sub.2.
A slurry for use in a polishing process comprising:
- alumina abrasive particles;
- a metal nitrate salt comprising Al(NO.sub.3).sub.3 ;
- H.sub.2 O.sub.2 ;
- and
- HNO.sub.3, wherein said slurry comprises between 2 and 40 wt. % alumina, 0.1 and 2.5 wt. % Al(NO.sub.3).sub.3, greater than 0 wt. % but less than or equal to 1 wt. % HNO.sub.3, and between 0.1 and 3 wt. % H.sub.2 O.sub.2.
A slurry for use in a polishing process comprising:
- abrasive particles:
- a metal nitrate salt comprising Al(NO.sub.3).sub.3 ;
- H.sub.2 O.sub.2, and
- HNO.sub.3, wherein said slurry comprises between 2 and 40 wt. % alumina, and between 0.1 and 3 wt. % H.sub.2 O.sub.2, and wherein said slurry comprises between 0.02 and 0.1 wt. % HNO.sub.3 and between 0.2 and 1 wt. % Al(NO.sub.3).sub.3.
A method for polishing comprising the step of polishing a workpiece with a slurry, said slurry comprising colloidal abrasive silica and a metal nitrate salt, said slurry having a pH less than about 3.5, said metal nitrate salt increasing the polishing rate of said slurry, wherein said workpiece comprises NiP.
A method for polishing comprising the step of polishing a workpiece with a slurry, said slurry comprising colloidal abrasive silica and a metal nitrate salt, said slurry having a pH less than about 3.5, said metal nitrate salt increasing the polishing rate of said slurry, wherein said workpiece comprises nickel or a nickel alloy.
A method for polishing comprising the step of polishing a workpiece with a slurry, said slurry comprising colloidal abrasive silica and a metal nitrate salt, wherein said workpiece comprises NiP.
A method for polishing comprising the step of polishing a workpiece with a slurry, said slurry comprising colloidal abrasive silica and a metal nitrate salt, wherein said workpiece comprises nickel or a nickel alloy.
A method for polishing comprising:
- applying a slurry against a workpiece so as to polish said workpiece, said slurry comprising abrasive particles and a metal nitrate, said slurry having a pH less than about 3.5, wherein said abrasive particles comprise colloidal silica and wherein said workpiece comprises NiP.
Dependencies are inferred from the claim text.