Die-bonding machine

A die-bonding machine for picking up a number of semiconductor pellets arranged in the form of a pellet array, one by one, to place a picked-up semiconductor pellet on a predetermined position, the die-bonding machine comprising:

• a pellet supporting and displacing mechanism for supporting said number of semiconductor pellets arranged in the form of the pellet array, and for displacing said number of semiconductor pellets arranged in the form of the pellet array, in an X direction and in a Y direction;
• and
• a pellet picking-up and carrying mechanism having a pellet sucking means which can be displaced in the X direction, in the Y direction and in a Z direction, for picking up one semiconductor pellet positioned on a pick-up position, from said number of semiconductor pellets supported by said pellet supporting and displacing mechanism, and for placing the picked-up semiconductor pellet on said predetermined position, said pick-up position being movable in the X direction and in the Y direction,
• wherein a center point of said pellet supporting and displacing mechanism is the origin of the coordinates in the X direction and in the Y direction,
• wherein an X-direction coordinate position and a Y-direction coordinate position of the semiconductor pellet to be picked up in relation to said pellet supporting and displacing mechanism are "x" and "y", respectively, and
• wherein a center position of an X-direction and Y-direction moving range of said pellet supporting and displacing mechanism is the origin of the coordinates,
• wherein said pellet supporting and displacing mechanism and said pellet picking-up and carrying mechanism are displaced so that an X-direction coordinate position PX and a Y-direction coordinate position PY of said pick-up position take a position expressed by a first equation and a second equation, respectively, said first equation being "PX=Ax" and said second equation being "PY=By", and an X-direction coordinate position CX and a Y-direction coordinate position CY of said center point of said pellet supporting and displacing mechanism take a position expressed by a third equation and a fourth equation, respectively, said third equation being "CX=-(1-A)x" and said fourth equation being "CY=-(1-B)y", A and B being positive numbers less than 1.

A die-bonding machine for selectively placing one of a plurality of semiconductor pellets on a predetermined position, comprising:

• a pellet supporting and displacing mechanism for supporting said number of semiconductor pellets arranged in the form of a pellet array, and for displacing said number of semiconductor pellets arranged in the form of the pellet array, in an X direction and in a Y direction;
• and
• a pellet picking-up and carrying mechanism having a suctioning device, for picking up one pellet on a pick-up position, from said plurality of semiconductor pellets supported by said pellet supporting and displacing mechanism, and for placing said one semiconductor pellet on said predetermined position
• wherein a center point of said pellet supporting and displacing mechanism is the origin of at least one of a coordinate in the X direction and one of a coordinate in the Y direction,
• wherein at least one of an X-direction coordinate position and a Y-direction coordinate position of the semiconductor pellet to be picked up in relation to said pellet supporting and displacing mechanism is at least one of"x" and "y", and
• wherein a center position of at least one of an X-direction and Y-direction moving range of said pellet supporting and displacing mechanism is the origin of the coordinates, and
• wherein said pellet supporting and displacing mechanism and said pellet picking-up and carrying mechanism are displaced so that at least one of an X-direction coordinate position and a Y-direction coordinate position of said pick-up position take a position,
• wherein said X-direction coordinate position PX of said pick-up position takes a position expressed by a first equation being "PX=Ax" and an X-direction coordinate position CX of said center point of said pellet supporting and displacing mechanism takes a position expressed by a second equation, said second equation being "CX=-(1-A)", where A is a positive number less than 1.