Adaptable planar module

A motor drive module comprising:

• a support base having top and bottom surfaces and having an opening therein which extends from said top surface to said bottom surface, a length and a width of said support base defining a first area;
• a planar, thermally conductive substrate disposed in said opening in said support base such that a bottom surface of said substrate is disposed to contact an external heatsink located beneath said bottom surface of said support base, a length and a width of said planar, thermally conductive substrate defining a second area such that said first area is at least approximately six times larger than said second area;
• at least one semiconductor device mounted on a top surface of said thermally conductive substrate;
• at least one circuit board arranged above and spaced from said top surface of said base and having an opening therein that is situated above said thermally conductive substrate;
• at least another device mounted on a top surface of said circuit board;
• said top surface of said circuit board having at least one bonding pad area arranged at a periphery of said opening in said circuit board and being electrically connected to said another device;
• and
• at least one bonding wire for connecting said one semiconductor device to said bonding pad.

A micro-converter module comprising:

• a support base having top and bottom surfaces and having an opening therein which extends from said top surface to said bottom surface, a length and a width of said support base defining a first area;
• a planar, thermally conductive substrate disposed in said opening in said support base such that a bottom surface of said substrate is disposed to contact an external heatsink located beneath said bottom surface of said support base, a length and a width of said planar, thermally conductive substrate defining a second area such that said first area is at least approximately six times larger than said second area;
• at least one semiconductor device mounted on a top surface of said thermally conductive substrate;
• at least one circuit board arranged above and spaced from said top surface of said base and having an opening therein that is situated above said thermally conductive substrate;
• at least another device mounted on a top surface of said circuit board;
• said top surface of said circuit board having at least one bonding pad area arranged at a periphery of said opening in said circuit board and being electrically connected to said another device;
• and
• at least one bonding wire for connecting said one semiconductor device to said bonding pad.

A semiconductor device module comprising:

• a planar, thermally conductive substrate having a bottom surface that is disposed to contact a heatsink located beneath said bottom surface;
• at least one semiconductor device mounted on a top surface of said thermally conductive substrate;
• at least one circuit board arranged above and spaced from a surface of the heatsink and having an opening therein that is situated above said thermally conductive substrate, said opening being approximately a same size as said thermally conductive substrate;
• at least another device mounted on a top surface of said circuit board;
• said top surface of said circuit board having at least one bonding pad area arranged at a periphery of said opening in said circuit board and being electrically connected to said another device;
• at least one bonding wire for connecting said one semiconductor device to said bonding pad;
• and
• a support structure for providing spacing between said circuit board and the heatsink.

A semiconductor device module comprising:

• a planar, insulated metal substrate having a bottom surface that is disposed to contact a heatsink located beneath said bottom surface;
• at least one semiconductor device mounted on a top surface of said insulated metal substrate;
• at least one circuit board arranged above and spaced from a surface of the heatsink and having an opening therein that is situated above said insulated metal substrate;
• at least another device mounted on a top surface of said circuit board;
• said top surface of said circuit board having at least one bonding pad area arranged at a periphery of said opening in said circuit board and being electrically connected to said another device;
• at least one bonding wire for connecting said one semiconductor device to said bonding pad;
• and
• a support structure for providing spacing between said circuit board and the heatsink, the support structure being comprised of an insulating material.