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US 6,147,010 AGranted
Solvent prewet and method to dispense the solvent prewet
AssigneeMicron Technology, Inc.
InventorJohn Whitman
Life of this patent
Estimating the term…
Abstract
A method and apparatus is provided for more efficiently application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating to accommodate the application of solvent tot he center of the wafer surface. The method also describes incorporating a new solvent comprising DI-Acetone Alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
Claims7
A method of coating a wafer, comprising:
- selecting a slow-drying solvent, wherein selecting a slow drying solvent includes selecting a solvent having a low vapor pressure, wherein the vapor pressure of the solvent is equal to or is lower than the vapor pressure of diacetone alcohol;
- wherein said solvent comprises diacetone alcohol;
- dispensing less than 1.0 cc of the solvent on the wafer as a pre-wet step, wherein the less than 1.0 cc of the solvent has an evaporation rate of greater than 1 second;
- spinning the wafer until the solvent is distributed across the wafer surface wherein the low vapor pressure solvent serves as the means for controlling wetting on the wafer surface;
- dispensing a photoresist solution on the wafer having solvent on its surface;
- spinning the wafer until the photoresist is distributed across the wafer surface wherein controlling the wetting on the wafer surface with the low vapor pressure solvent allows for even distribution and wetting of the wafer surface using less solvent than conventional acetate solvents and reduces the surface tension such that the low vapor pressure solvent reduces the amount of photoresist necessary to coat the entire wafer;
- and
- wherein the longer dry time associated with the low vapor pressure solvent allows the solvent more time to flow and evenly distribute across the wafer surface than possible with conventional acetate solvents which reduces a ramping rate for spinning the wafer as required to flow and evenly distribute a solvent across the wafer surface wherein said conventional acetate solvents are those having higher vapor pressures than diacetone alcohol.
5 more elements
A method of coating a wafer, comprising:
- incorporating an additional nozzle into a wafer processing machine;
- positioning the additional nozzle such that it is directed at the center of a wafer held in the wafer processing machine;
- causing the nozzle to dispense less than 1.0 cc of a solvent on the wafer as a pre-wet step by triggering a solenoid, the solvent having a low vapor pressure, wherein the vapor pressure of the solvent is equal to or is lower than the vapor pressure of diacetone alcohol;
- wherein said solvent comprises diacetone alcohol;
- spinning the wafer until the solvent is distributed across the wafer surface wherein the low vapor pressure solvent serves as the means for controlling wetting on the wafer surface;
- dispensing a photoresist solution on the wafer having solvent on its surface;
- spinning the wafer until the photoresist is distributed across the wafer surface wherein controlling the wetting on the wafer surface with the low vapor pressure solvent allows for even distribution and wetting of the wafer surface using less solvent than conventional acetate solvents and reduces the surface tension such that the low vapor pressure solvent reduces the amount of photoresist necessary to coat the entire wafer;
- and
- wherein the longer dry time associated with the low vapor pressure solvent allows the solvent more time to flow and evenly distribute across the wafer surface than possible with conventional acetate solvents which reduces a ramping rate for spinning the wafer as required to flow and evenly distribute a solvent across the wafer surface wherein said conventional acetate solvents are those having higher vapor pressures than diacetone alcohol.
6 more elements
A method of coating a wafer, comprising:
- positioning a nozzle such that it is directed at the center of a wafer;
- controlling the nozzle with a solenoid;
- causing the nozzle to dispense less than 1.0 cc of a solvent on the wafer as a pre-wet step by signaling the solenoid, the solvent having a low vapor pressure, wherein the vapor pressure of the solvent is equal to or is lower than the vapor pressure of diacetone alcohol;
- wherein said solvent comprises diacetone alcohol;
- spinning the wafer until the solvent is distributed across the wafer surface wherein the low vapor pressure solvent serves as the means for controlling wetting on the wafer surface;
- dispensing a photoresist solution on the wafer before the solvent on the wafer surface is dry;
- spinning the wafer until the photoresist is distributed across the wafer surface wherein controlling the wetting on the wafer surface with the low vapor pressure solvent allows for even distribution and wetting of the wafer surface using less solvent than conventional acetate solvents and reduces the surface tension such that the low vapor pressure solvent reduces the amount of photoresist necessary to coat the entire wafer;
- and
- wherein the longer dry time associated with the low vapor pressure solvent allows the solvent more time to flow and evenly distribute across the wafer surface than possible with conventional acetate solvents which reduces a ramping rate for spinning the wafer as required to flow and evenly distribute a solvent across the wafer surface wherein said conventional acetate solvents are those having higher vapor pressures than diacetone alcohol.
6 more elements
A method of coating a wafer, comprising:
- mounting the wafer in a wafer processing machine having a nozzle;
- positioning the nozzle such that it is directed at the center of the wafer;
- controlling the nozzle with a solenoid;
- causing the nozzle to dispense less than 1.0 cc of a solvent on the wafer as a pre-wet step by signaling the solenoid, the solvent having a low vapor pressure, wherein the vapor pressure of the solvent is equal to or is lower than the vapor pressure of diacetone alcohol;
- wherein said solvent comprises diacetone alcohol;
- spinning the wafer until the solvent is distributed across the wafer surface wherein the low vapor pressure solvent serves as the means for controlling wetting on the wafer surface;
- dispensing a photoresist solution on the wafer before the solvent on the wafer surface is dry;
- spinning the wafer until the photoresist is distributed across the wafer surface wherein controlling the wetting on the wafer surface with the low vapor pressure solvent allows for even distribution and wetting of the wafer surface using less solvent than conventional acetate solvents and reduces the surface tension such that the low vapor pressure solvent reduces the amount of photoresist necessary to coat the entire wafer;
- and
- wherein the longer dry time associated with the low vapor pressure solvent allows the solvent more time to flow and evenly distribute across the wafer surface than possible with conventional acetate solvents which reduces a ramping rate for spinning the wafer as required to flow and evenly distribute a solvent across the wafer surface wherein said conventional acetate solvents are those having higher vapor pressures than diacetone alcohol.
7 more elements
Dependencies are inferred from the claim text.