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US 6,146,924 AGranted
Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process
AssigneeVanguard International Semiconductor Corporation
InventorsDaniel Chang, Chengder Huang, Pei-Haw Tsao
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Abstract
A new method is provided for the creation of a pre-molded chip carrier. The invention teaches putting magnetic inserts into the upper mold. The magnetic inserts attract the lead fingers that are inserted into the upper mold during the process of filling the cavity with a compound pressing the lead fingers tightly against the surface of the magnet. The possibility of mold compound spilling over the lead fingers and forming resin depositions on the surface of the lead fingers is thereby voided.
Claims10
A method of forming a pre-molded plastic chip carrier, comprising the steps of:
- forming a lower mold said lower mold containing a lower mold cavity;
- forming an upper mold said upper mold containing an upper mold cavity;
- inserting magnets into said upper mold;
- attaching a die pad and conducting lead fingers to said upper mold;
- mating said lower mold with said upper mold thereby creating a complete mold assemblage with a complete mold cavity;
- injecting a molding compound into said complete mold cavity;
- curing said injected molding compound;
- and removing said lower and upper mold thereby freeing said pre-molded plastic chip carrier.
5 more elements
Dependencies are inferred from the claim text.