Hybrid frame with lead-lock tape
AssigneeMicron Technology, Inc.
InventorsJerry M. Brooks, Larry D. Kinsman, Timothy J. Allen
Life of this patent
Estimating the term…
Abstract
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die is provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.
Claims40
A method of manufacturing a semiconductor device, comprising:
- forming a lead frame having a plurality of inwardly extending leads, said plurality of inwardly extending leads defining a die position, having a first and second end, and having at least one substantially longitudinally extending bussing lead between said first end and said second end of said lead frame and across at least a portion of said die position, said at least one substantially longitudinally extending bussing lead formed to have at least one intermediate angled portion;
- and
- attaching at least one tape segment between said at least one substantially longitudinally extending bussing lead and a portion of said lead frame.
A method of manufacturing a semiconductor device connected to a hybrid lead frame, said method comprising the steps of:
- forming a hybrid lead frame having a plurality of inwardly extending leads, said plurality of inwardly extending leads defining a die position, having a first and second end and having at least one substantially longitudinally extending bussing lead between said first end and said second end of said lead frame and across at least a portion of said die position, said at least one substantially longitudinally extending bussing lead formed to have at least one intermediate angled portion;
- and
- attaching at least one tape segment between said at least one substantially longitudinally extending bussing lead and a portion of said hybrid lead frame.
A method of manufacturing a semiconductor device, comprising:
- forming a lead frame having a plurality of inwardly extending leads, said plurality of inwardly extending leads defining a die position, having a first and second end and having a plurality of substantially longitudinally extending bussing leads between said first end and said second end of said lead frame and across at least a portion of said die position, at least one of said plurality of substantially longitudinally extending bussing leads formed to have at least one intermediate angled portion;
- and
- attaching at least one tape segment between at least two of said plurality of substantially longitudinally extending bussing leads proximate distal ends of said at least two of said plurality of substantially longitudinally extending bussing leads.
A method of manufacturing a semiconductor device connected to a hybrid lead frame, said method comprising the steps of:
- forming a hybrid lead frame having a plurality of inwardly extending leads, said plurality of inwardly extending leads defining a die position, having a first and second end and having a plurality of substantially longitudinally extending bussing leads between said first end and said second end of said lead frame and across at least a portion of said die position, at least one of said plurality of substantially longitudinally extending bussing leads formed to have at least one intermediate angled portion;
- and
- attaching at least one tape segment between at least two of said plurality of substantially longitudinally extending bussing leads proximate distal ends of said at least two of said plurality of substantially longitudinally extending bussing leads.
Dependencies are inferred from the claim text.