Wafer transfer cassette
AssigneeApplied Materials, Inc.
InventorsBrian H. Burrows, Joseph A. Kraus, Gregory S. Verdict
Life of this patent
Estimating the term…
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AssigneeApplied Materials, Inc.
InventorsBrian H. Burrows, Joseph A. Kraus, Gregory S. Verdict
Estimating the term…
A wafer transfer cassette of the kind which includes a support frame, a first wafer supporting construction, and a second wafer supporting construction. The support frame includes first and second vertically extending support structures which are horizontally spaced from one another. The first wafer supporting construction includes a first bracket portion and a first fin portion extending from the first bracket portion. The first bracket portion is mounted to the first support structure in a position wherein the first fin portion extends from the first bracket portion towards the second support structure. The second wafer supporting construction includes a second bracket portion and a second fin portion extending from the second bracket portion. The second bracket portion is mounted to the second support structure in a position wherein the second fin portion extends from the second support structure towards the first support structure. The first and second fin portions have upper surfaces positioned relative to one another to jointly support a wafer in substantially a horizontal orientation.
A wafer transfer cassette comprising:
A wafer transfer cassette comprising:
Dependencies are inferred from the claim text.