Heat sink module with heat dissipating device
AssigneeFoxconn Precision Components Co., Ltd.
InventorWei Ta Lo
Life of this patent
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Abstract
A heat sink module with a heat dissipating device comprises a heat sink, a clip, a fan with screws, a first attaching member, a pipe and a second attaching member. The first attaching member is used for attaching to an air opening of a computer enclosure. The first attaching member connects with the pipe and communicates with the air opening for transporting cool air therefrom. The second attaching member comprises a recessed base for attaching to the heat sink. The fan is received in the central portion of the recessed base, and is secured on the heat sink. Another end of the pipe communicates with the recessed base for transporting cool air from outside to cool the heat sink. Thus, heat dissipating efficiency is significantly improved.
Claims6
A heat sink module assembly comprising:
- a heat sink module including a heat sink and a fan mounted on the heat sink, the heat sink defining rows of fins thereon and a pair of locking portions formed at lateral sides thereof;
- and
- a heat dissipating device including:
- a first attaching member for attaching to an air opening of a computer enclosure;
- a second attaching member for attaching to the heat sink, the second attaching member defining a stepped connection portion thereon and a plurality of locking elements extending from lateral edges thereof, each locking element comprising a barb portion and a handle portion for facilitating the assembly/disassembly process with the locking portions of the heat sink, the barb portions extending outwardly while the corresponding locking portions of the heat sink extend inwardly for easily engaging with each other;
- and
- a flexible pipe connected between the first and the second attaching members.
Dependencies are inferred from the claim text.