Electronic component mounting apparatus
AssigneeMatsushita Electric Industiral Co., Ltd.
InventorEiichi Hachiya
Life of this patent
Estimating the term…
Abstract
The electronic component mounting apparatus includes: a tray feed section (4) for feeding an electronic component (2) to be placed; an x-axis robot (5) and a y-axis robot (6) for moving the electronic component (2) to be placed; a head section (7) for holding and moving the electronic component; a 3D sensor (8); and an image memory for storing height data as three-dimensional image data, thus enabling the positioning and the three-dimensional component configuration check of the electronic component (2) to be accomplished simultaneously in one process.
Claims13
An electronic component mounting apparatus comprising:
- a component feeding section (4) for feeding an electronic component (2) to be mounted onto a board;
- a head section (7) for holding the electronic component (2) fed from the component feeding section (4);
- a head section-moving device (5,6) for moving the head section (7) holding the electronic component (2);
- a three-dimensional image-acquiring device (8), provided at a position below a moving range of the head section (7), for performing, with a laser beam, line scanning the component (2) held by the head section (7) to obtain, from each scanning line, positional data of a position where the component is present and height data of the component (2) corresponding to the positional data;
- an image memory (35) for storing the height data obtained from the three-dimensional image-acquiring device (8) as three-dimensional image data;
- and
- a control section (21) for performing image processing for the three-dimensional image data of the electronic component (2), and mounting the component onto the board based on the obtained height data and the obtained positional data of the position, and result of the image processing for the three-dimensional image data.
An electronic component mounting apparatus comprising:
- a moving device (5,6) for moving an electronic component (2) to be mounted onto a board;
- a polygon mirror (8) disposed at a position below the moving device;
- a semiconductor laser (10) which emits a laser beam for the polygon mirror;
- a position sensing device (17a,17b) disposed at a position around the polygon mirror;
- and
- an image-forming lens (16a,16b) for forming as an image on the position sensing device the laser beam that has struck a bottom surface of the electronic component,
- wherein the semiconductor laser is so placed that its laser beam will strike the rotating polygon mirror, being thereby reflected, and strike the bottom surface of the electronic component that passes above the polygon mirror, and wherein a three-dimensional image of the electronic component obtained by computing data outputted by the position sensing device is acquired into an image memory based on a passing operation of the electronic component above the polygon mirror by the moving device and laser scanning triggered by a rotating operation of the polygon mirror, whereby a positioning of the electronic component and a configuration check thereof are performed with the three-dimensional image, and the component is mounted onto the board based on result of the positioning of the electronic component and the configuration check thereof.
Dependencies are inferred from the claim text.