Techniques for improving adhesion of silicon dioxide to titanium
AssigneeMicron Technology, Inc.
InventorRavi Iyer
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Abstract
The present invention is described in several embodiments depicting structures and methods to form these structures. A first embodiment is a structure having a silicon dioxide film bonded to a metal film comprising: a metal nitride film bonded to the metal film; and the silicon dioxide film bonded to the metal nitride film. A second embodiment is a structure having a silicon dioxide film bonded to a metal film comprising: a metal oxide film bonded to the metal film; and the silicon dioxide film bonded to the metal oxide film. A third embodiment is a structure having a silicon dioxide film bonded to a metal film comprising: a metal/oxide/nitride film bonded to the metal film; and the silicon dioxide film bonded to the metal/oxide/nitride film.
Claims4
A structure having a silicon dioxide film bonded to a metal film comprising:
- a metal oxide film bonded to said metal film;
- an oxygen deficient film consisting of silicon oxide,
- said oxygen deficient film bonded to said metal oxide film;
- and
- said silicon dioxide film bonded to said oxygen deficient film, wherein said metal oxide film comprises titanium oxide.
A structure having a silicon dioxide film bonded to a metal film comprising:
- a metal/oxide/nitride film bonded to said metal film;
- an oxygen deficient film consisting of silicon oxide, said oxygen deficient film bonded to said metal/oxide/nitride film;
- and
- said silicon dioxide film bonded to said oxygen deficient film.
Dependencies are inferred from the claim text.