Leadframe for semiconductor chips and semiconductor module having the lead frame
AssigneeInfineon Technologies AG
InventorsJens Pohl, Michael Blumenauer, Ulrich Vidal
Life of this patent
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Abstract
A leadframe for connection to a semiconductor chip, in particular a metal leadframe, includes a plurality of lead prongs and at least two raised lead surfaces. When a semiconductor module that includes the leadframe and a semiconductor chip is sheathed with plastic, the raised lead surfaces assure a uniform flow of a plastic composition in a mold cavity and thus prevent air from becoming trapped in a plastic package. The lead surfaces are preferably created by folding over tabs in the leadframe. The invention also relates to preliminary stages of the leadframe and to semiconductor components that contain the leadframe of the invention.
Claims28
A leadframe for connection to a semiconductor chip, comprising:
- a plurality of lead prongs disposed in a plane, at least two of said lead prongs each having a raised guide structure disposed in a region of said plane to be filled with a plastic composition for slowing down a flow of the plastic composition, said guide structures extending in a direction perpendicular to said plane.
A leadframe for connection to a semiconductor chip with the LOC mounting technique, comprising:
- a plurality of lead prongs disposed in a plane, at least two of said lead prongs each having a raised guide structure disposed in a region of said plane to be filled with a plastic composition for slowing down a flow of the plastic composition, said guide structures extending in a direction perpendicular to said plane.
A leadframe for connection to a semiconductor chip for the production of a DRAM component, comprising:
- a plurality of lead prongs disposed in a plane, at least two of said lead prongs each having a raised guide structure disposed in a region of said plane to be filled with a plastic composition for slowing down a flow of the plastic composition, said guide structures extending in a direction perpendicular to said plane.
A semiconductor module, comprising:
- a semiconductor chip;
- and
- a leadframe connected to said semiconductor chip, said leadframe having a plurality of lead prongs disposed in a plane, at least two of said lead prongs each having a raised guide structure disposed in a region of said plane to be filled with a plastic composition for slowing down a flow of the plastic composition, said guide structures extending in a direction perpendicular to said plane.
A DRAM component, comprising:
- a semiconductor chip;
- and
- a leadframe connected to said semiconductor chip, said leadframe having a plurality of lead prongs disposed in a plane, at least two of said lead prongs each having a raised guide structure disposed in a region of said plane to be filled with a plastic composition for slowing down a flow of the plastic composition, said guide structures extending in a direction perpendicular to said plane.
Dependencies are inferred from the claim text.