Method of cleaning semiconductor wafers and other substrates

A method of cleaning a substrate comprising:

• inserting said substrate vertically into a region located between a first brush and a second brush, said first brush being mounted to a first shaft mounted to a first plate, said second brush being mounted to a second shaft mounted to a second plate;
• moving said first plate and said first brush toward said substrate, wherein the motion of said first plate causes an equal and opposite motion of said second plate and said second brush, whereby said first brush contacts a first surface of said substrate and said second brush contacts a second surface of said substrate opposite said first surface of said substrate;
• rotating said first brush and said second brush;
• rotating said substrate;
• wetting said first brush, said second brush and said first surface and said second surface of said substrate;
• and
• cleaning said substrate by contact between said rotating first and second brushes and said first and second surfaces, respectively, of said rotating substrate.