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US 6,110,832 AGranted
Method and apparatus for slurry polishing
AssigneeInternational Business Machines Corporation
InventorsClifford O. Morgan, III, Matthew J. Rutten, Erick G. Walton, Terrance M. Wright
Life of this patent
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Abstract
A method and apparatus for Chemical-Mechanical Polishing of semiconductor wafers using various formulations of high viscosity slurry.
Claims18
A method of Chemical Mechanical Polishing of a wafer, the method comprising of the steps of:
- dispensing a high viscosity slurry onto a rotating polishing pad;
- and
- pressing the wafer onto the slurry coated polishing pad.
An apparatus for Chemical Mechanical Polishing of a wafer, the apparatus comprising:
- means for dispensing a high viscosity slurry onto a rotating polishing pad;
- and
- means for pressing the wafer onto the slurry coated polishing pad.
Dependencies are inferred from the claim text.