Apparatus and method for electroplating a metal onto a substrate

A method for electroplating a substrate, which is moveable in a substrate direction, the substrate having an upper substrate surface and a lower substrate surface, said upper substrate surface and said lower substrate surface each having a first width portion and a second width portion, the method comprising the steps of:

• providing a housing having a electroplating chamber for containing an electroplating fluid, the housing also having at least one substrate port allowing the substrate to move through the electroplating chamber;
• transporting the substrate into the electroplating chamber;
• directing a first stream being configured such that the first stream includes a first stream upper portion and a first stream lower portion, the first stream upper portion flowing across the first width portion on the upper substrate surface, and the first stream lower portion flowing across the first width portion on the lower substrate surface;
• and
• directing a second stream being configured such that the second stream includes a second stream upper portion and a second stream lower portion, the second stream upper portion flowing across the second width portion on the upper substrate surface, and the second stream lower portion flowing across the second width portion on the lower substrate surface,
• electroplating using a first electrode electrically contacting the substrate;
• a second electrode positioned adjacent to the substrate within the electroplating chamber, the second electrode being in electrical contact with the substrate through the electroplating fluid, the second electrode charged oppositely to the first electrode by means of an external power supply, and transporting the substrate out of the electroplating chamber.