US 6,046,496 A · Chip package

Abstract

The present invention relates to a heat management structure within a chip package that allows for heat rejection away from a chip but that avoids the prior art problems of thermal stresses caused by dissimilar thermal conductivities of a heat management structure and of creating a thermally unbalanced package due to disparate distribution of packaging plastic. In an embodiment of the present invention a package includes a chip, leads on the chip, a die attach, a downset, a packaging plastic, and an outer structure among others. The outer structure, downset, and die attach are together a substantially unitary article. Achieving a balanced package that substantially resists warpage and bowing during ordinary manufacture and ordinary use in the life of the package is accomplished by balancing packaging material width and the ability of the downset to resist warpage and bowing stresses. A substantial portion of the outer structure is exposed to the external part of the package in the surface which includes the packaging lower edge. Alternatively, the downset can include a part of the external boundary of the package such that exposure of the downset to the external portion of the package allows for additional heat rejection away from the chip in addition to the use of the outer structure.

Claims35

Dependent claims

A chip package comprising:

a single piece of material that includes:
a die attach structure;
an outer structure surrounding said die attach structure, wherein there is at least one opening between said die attach structure and said outer structure;
and
at least one downset connecting said die attach structure and said outer structure
a die disposed upon said die attach structure;
a packaging material encapsulating said die, said die attach structure, and said at least one downset.

4 more elements

Dependencies are inferred from the claim text.

Chip package

Life of this patent

Chip package

Life of this patent

Abstract

Claims35