In a flash E.sup.2 PROM cell having n.sup.+ source and drain regions disposed in a p-type substrate, a channel region intermediate to said source and drain regions, a tunnel dielectric layer overlying said channel region, a floating gate overlying said tunnel dielectric layer, an inter-poly dielectric layer overlying said floating gate and a control gate overlying said inter-poly dielectric layer, the improvement comprising a highly doped p.sup.+ pocket implant adjoining one of said drain and source regions along a portion of the width of said cell for creating a metalurgical junction having narrow depletion width, said portion of the width of said cell defining a program section of said cell and the remaining width of said cell defining a sense section thereof.