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US 6,031,279 AGranted
Power semiconductor component
AssigneeSiemens Aktiengesellschaft
InventorMichael Lenz
Life of this patent
Estimating the term…
Abstract
A power semiconductor component includes a first chip having a vertical first transistor. A second chip with a second vertical transistor is mounted on the first chip in such a way that load paths of the two transistors are connected in series. The configuration can easily be expanded into a full bridge.
Claims5
A power semiconductor component, comprising:
- a cooling surface;
- a first chip mounted on said cooling surface and having a vertical first transistor with a load path and least one second transistor with a source side insulated from said first transistor and with a load path;
- a second chip mounted on said first chip and having a vertical third transistor with a load path, said load paths of said first and third transistors connected in series;
- and
- at least one third chip mounted on said first chip and having a vertical fourth transistor with a load path, said load paths of said second and fourth transistors connected in series.
2 more elements
Dependencies are inferred from the claim text.