Surface-mountable device having a voltage variable polgmeric material for protection against electrostatic damage to electronic components
AssigneeLittelfuse, Inc.
InventorAndrew J. Neuhalfen
Life of this patent
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AssigneeLittelfuse, Inc.
InventorAndrew J. Neuhalfen
Estimating the term…
The thin film, circuit device is an subminiature overvoltage protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device includes three material subassemblies. The first subassembly generally includes a substrate carier, electrodes, and terminal pads for connecting the protection device 60 to a PC board. The second subassembly includes a voltage variable polymer material with non-linear characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device.
A surface-mounted circuit protection device comprising:
Dependencies are inferred from the claim text.