Apparatus and method for probing multiple integrated circuit dice in a semiconductor wafer

Abstract

Multiple integrated circuit dice can be simultaneously engaged for probe testing by providing a wedge card having a plurality of needle probes mounted thereon and extending along two orthogonal directions with the probe cards being planarized below a first major surface. Each wedge card can then engage at least two integrated circuits simultaneously. The wedge cards and manipulators can be mounted on a probe card around a central opening for testing integrated circuit die through the opening, alternatively, the probe card and manipulator can be mounted to two movable rods attached to respective pairs of manipulators mounted on a platen around the semiconductor wafer with the rods and manipulators moving the wedge card and manipulator along two axes (X,Y) with the wedge card manipulator moving the wedge card in a third axis (Z). Multiple integrated circuits can be simultaneously tested, and the manipulators for controlling the needle probes on a wedge card are distributed around the semiconductor wafer and away from heat generated by the integrated circuits undergoing tests. Further, the distributed manipulators can control a plurality of wedge cards in the two axes (X,Y).

Dependencies are inferred from the claim text.