Chip network resistor and method for manufacturing same

A chip-like network resistor comprising:

• an insulating ceramic substrate having a top surface, an opposing bottom surface disposed generally parallel to said top surface, a first end and an opposing second end;
• said first end being formed with a plurality of recesses and said opposing second end being formed with an equal number of recesses each corresponding to a recess formed in said first end;
• each of said recesses having an inner surface, a top edge and a bottom edge, said inner surface being defined as that portion of the insulating substrate exposed within each recess that is between said top surface and said bottom surface, said top edge being defined as the interface between said inner surface and said top surface, and said bottom edge being defined as the interface between said inner surface and said bottom surface;
• a plurality of thick-film electrodes formed from a conductive glass paste on said top surface of said insulating substrate, each of said thick-film electrodes being disposed adjacent to said top edge of one of said recesses;
• a plurality of resistance elements each formed from a glass paste on said top surface of said insulating substrate in a manner so as to extend between and connect a pair of thick-film electrodes adjacent to a pair of corresponding recesses;
• a glass coating covering said plurality of resistance elements;
• either an additional glass coating or a resin coating arranged so as to cover said glass coating;
• a plurality of terminal electrodes arranged in a manner to correspond to each of said thick-film electrodes;
• said terminal electrodes each comprising a thin metal film electrode layer, a nickel plated layer, and a solder plated layer, said thin metal film electrode layer comprising a top surface electrode section formed on said top surface of said insulating substrate so as to overlap with at least a portion of said thick-film electrode, a side surface electrode section connected to said top surface electrode section and arranged so as to entirely cover said inner surface of said recess, and a bottom surface electrode section formed on said bottom surface of said insulating substrate and connected to said side surface electrode section;
• said nickel plated layer covering said thin metal film electrode layer;
• and
• said solder plated layer covering said nickel plated layer;
• said top surface electrode section of said thin metal film electrode layer being disposed on said top surface in an arcuate configuration so as to fully surround said top edge of said recess and overlap said thick-film electrode.

A method of manufacturing a chip-like network resistor, comprising the steps of:

• providing an insulating substrate sheet having a top surface and an opposing bottom surface which is disposed generally parallel to said top surface, said top surface of said sheet having formed therein a matrix of intersecting lateral and longitudinal grooves, said sheet being provided with a plurality of through-holes, said through-holes being arranged so as to bisect said lateral grooves between said intersecting longitudinal grooves;
• forming a plurality of thick-film electrodes on said top surface of said insulating substrate sheet adjacent to said through-holes, said thick-film electrodes being disposed so as not to extend across said lateral and longitudinal grooves;
• forming a plurality of resistance elements on said top surface of said insulating substrate sheet in a manner so as to extend between and connect a pair of said thick-film electrodes, said plurality of resistance elements being disposed so as not to extend across said lateral and longitudinal grooves;
• covering the resistance elements with a glass coating;
• forming a thin metal film terminal electrode at each through-hole, each of said thin metal film terminal electrodes comprising a top surface electrode, an inner electrode, and a bottom surface electrode, said top surface electrode being disposed on said top surface of said sheet so as to fully surround the opening of a through-hole and overlap said thick-film electrodes adjacent thereto, said inner electrode being disposed so as to cover an inner surface of each of said through-holes, said inner surface being defined as that portion of the insulating substrate exposed within each through-hole that is between said top surface of said sheet and said bottom surface of said sheet, and said bottom surface electrode being disposed so as to fully surround the opening of a through-hole in said bottom surface of said sheet;
• contacting a distal end of a resistance measuring probe with each of said top surface electrodes positioned on both sides of a resistance element, measuring the resistance of said resistance element, and subjecting said resistance element to laser trimming depending on the resistance measured;
• covering said glass coating with either an additional glass coating or a resin coating after said laser trimming;
• separating said insulating substrate sheet into a plurality of chip-like network resistor elements along said longitudinal grooves and lateral grooves;
• and
• subjecting each of said thin metal terminal electrodes on each of said chip-like network resistor elements to plating.