Method of measuring interconnect coupling capacitance in an IC chip
AssigneeSimplex Solutions, Inc.
InventorsNarain D. Arora, Jian Wang
Life of this patent
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AssigneeSimplex Solutions, Inc.
InventorsNarain D. Arora, Jian Wang
Estimating the term…
A method for measuring the coupling capacitance between two interconnect lines of an integrated circuit structure having a ground plane. The steps include shorting the first and second lines together and measuring a first capacitance (Ct) between the ground plane and the shorted first and second lines; eliminating the short between the first and second lines; shorting the first line to the ground plane and measuring a second capacitance (C1) between the second line and the shorted ground plane and first line; eliminating the short between the first line and the ground plane; shorting the second line to the ground plane and measuring a third capacitance (Cc) between the first line and the shorted ground plane and second line; and determining the coupling capacitance between the first line and the second line according to the formula Cc=(C1+C2-Ct)/2.
A method for measuring the coupling capacitance between two lines of an integrated circuit structure, comprising:
Dependencies are inferred from the claim text.