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US 5,999,003 AGranted
Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification
AssigneeAdvanced Micro Devices, Inc.
InventorsPaul J. Steffan, Ming Chun Chen
Life of this patent
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Abstract
A method to accurately classify defects on a semiconductor wafer wherein a scanning tool detects defects and assigns values to parameters that are characteristic of each defect. The values of the characteristic parameters represent a thumbprint of each defect and the defects are placed into "bins" according to the thumbprint of each defect. A sample of defects in each bin is analyzed and assigned a classification code.
Claims4
A method to accurately classify defects on a semiconductor wafer, the method comprising:
- (a) sending a wafer through a processing step;
- (b) detecting defects on the wafer in a scanning tool wherein parameters characteristic of each defect are measured wherein the measured parameters represent a thumbprint of the defect;
- (c) assigning each defect to a bin in accordance with the thumbprint of each defect;
- (d) calculating a ratio to determine the number of defects from each bin to be analyzed by dividing the total number of defects to be analyzed from all bins by the total number of defects assigned to all bins;
- (e) selecting the number of defects from each bin by multiplying the number of defects in each bin by the ratio calculated in step (d);
- and
- (f) analyzing the number of defects selected from each bin in step (e) and assigning a classification code to the analyzed defects.
4 more elements
Dependencies are inferred from the claim text.