Method for washing and drying substrates
AssigneeTokyo Electron Limited
InventorMiyako Yamasaka
Life of this patent
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Abstract
A method for washing and drying a substrate includes the steps of (a) disposing a substrate on a spin chuck such that a surface to be treated faces upward, (b) applying a washing solution from a first nozzle to the surface of the substrate while rotating the substrate disposed on the spin chuck so as to cleanse the surface, and (c) blowing a gas from a second nozzle against the surface while rotating the substrate and moving the second nozzle above the substrate in a radial direction from a central portion toward a peripheral portion of the substrate, thereby drying the surface of the substrate.
Claims12
A method for washing and drying a substrate, the steps of comprising:
- disposing the substrate on a spin chuck such that a surface of the substrate to be treated faces upward;
- applying a washing solution from a first nozzle to the surface of the substrate while the substrate disposed on the spin chuck rotates;
- and
- blowing a gas from a second nozzle to the surface while the substrate disposed on the spin chuck rotates and while the second nozzle moves above the surface in a radial direction of the substrate from a central portion toward a peripheral portion of the substrate, thereby drying the surface of said substrate.
Dependencies are inferred from the claim text.