US 5,982,041 A · Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices

Abstract

A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane. Also, a fabrication method characterized by mounting a semiconductor chip on a substrate or in a package with the aforesaid silicone die attach adhesive sandwiched between the semiconductor chip and substrate or package, then inducing the free radical reaction of the acrylic functional groups by exposing the die attach adhesive to high-energy radiation, and thereafter curing the die attach adhesive by the hydrosilylation reaction. A semiconductor device characterized in that it has been fabricated by the above-described method.

Claims13

Dependent claims

A silicone die attach adhesive prepared from a siloxane composition wherein said siloxane composition is curable via both a free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation and a hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane.

A siloxane composition, comprising:

(A) 100 parts by weight parts of an organopolysiloxane composition comprising
(a) 5 to 95 weight % of an acrylic functional group containing organopolysiloxane having an average of at least two silicon-bonded acrylic functional groups per molecule, said silicon bonded acrylic functional groups having the formula:
##STR18## wherein R.sup.1 is hydrogen or a monovalent hydrocarbon group, R.sup.2 is hydrogen or a monovalent hydrocarbon group, and R.sup.3 is a C.sub.1 to C.sub.10 divalent hydrocarbon group;
and
(b) 95 to 5 weight % of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule;
(B) a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (b);
(C) 0.01 to 10 parts by weight of a photosensitizer;
and
(D) platinum catalyst in sufficient quantity to cure the curable siloxane compositions;
wherein said siloxane composition is curable, via both
(i) free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation;
and
(ii) hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane.

10 more elements

A siloxane composition, comprising:

(A') 100 parts by weight parts of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule;
(B') a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (A');
(C) 0.01 to 10 parts by weight of a photosensitizer;
and
(D) platinum catalyst in sufficient quantity to cure the curable siloxane composition
wherein said siloxane composition is curable, via both
(i) a free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation;
and
(ii) a hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane, and wherein at least one component selected from the group consisting of component (A') and component (B') has an average of at least two silicon-bonded acrylic functional groups having the formula:
##STR21## wherein R.sup.1 is hydrogen or a monovalent hydrocarbon group, R.sup.2 is hydrogen or a monovalent hydrocarbon group, and R.sup.3 is a C.sub.1 to C.sub.10 divalent hydrocarbon group.

7 more elements

Dependencies are inferred from the claim text.

Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices

Life of this patent

Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices

Life of this patent

Abstract

Claims13