Method and structure for manufacturing high-resistance polysilicon loads in a semiconductor process
AssigneeWinbond Electronics Corp.
InventorMing-Lun Chang
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AssigneeWinbond Electronics Corp.
InventorMing-Lun Chang
Estimating the term…
High-resistance polysilicon layers applied in 4T SRAM memory cells serving as loads, are manufactured by a simple method according to the invention. In the small-scale 4T SRAM memory cell process, it is not possible to fabricate traditional polysilicon loads manufactured by the prior art with a desired high degree of resistance. As a result, the miniaturization of 4T SRAM memory cells has been limited. However, in the method according to the invention, the lengths of polysilicon loads are greatly increased without increasing the sizes of corresponding memory cells, thereby efficiently increasing the resistance of the polysilicon loads. Therefore, this method according to invention can completely eliminate any limitation to the small-scale 4T SRAM memory cell process caused by the manufacture of the polysilicon loads as described above.
A method for manufacturing high-resistance polysilicon loads in a semiconductor process, suitable for a substrate in which a plurality of conductive layers are already formed, comprising:
Dependencies are inferred from the claim text.