Enhanced heat sink attachment
AssigneeSun Microsystems, Inc.
InventorMohammed Tantoush
Life of this patent
Estimating the term…
Abstract
A slug or plate of copper or some other material having high heat conductivity is attached by an adhesive such as epoxy to a heat-emitting electrical component such as a chip, ASIC, microprocessor, or the like. A heat sink having a base and a plurality of fins upstanding from the base is attached to the slug or plate by screws, nuts or other, preferably detachable, means. The bottom of the base may be formed with a socket to receive the slug. The heat sink may be larger than the slug, thereby improving heat dissipation. When it is necessary to replace the component, the heat sink is detached from the slug and re-used.
Claims5
A heat dissipating device comprising an electronic heat-emitting component, a thin member of high heat transferring material shaped for intimate heat transference when positioned contacting said component, said member having substantially the same width and length as said component, an adhesive adhering said member to said component, a heat sink having a base having a first surface, said first surface having a plurality of heat dissipating fins projecting therefrom, a second surface of said base being shaped for intimate heat transference to said member, said second surface being formed with a pocket for said member and for said component, said pocket being at least as large in width and length as said member, and at least one detachable screw fastener connecting said heat sink to said member.
Dependencies are inferred from the claim text.